| 作 者： | 刘昶 |
| 出版社： | 机械工业出版社 |
| 丛编项： | 经典原版书库 |
| 版权说明： | 本书为公共版权或经版权方授权，请支持正版图书 |
| 标 签： | 维修 |
| ISBN | 出版时间 | 包装 | 开本 | 页数 | 字数 |
|---|---|---|---|---|---|
| 未知 | 暂无 | 暂无 | 未知 | 0 | 暂无 |
PREFACE
A NOTE TO INSTRUCTORS
ABOUT THE AUTHOR
NOTATIONAL CONVENTIONS
Chapter 1 Introduction
1.0 Preview
1.1 The History of MEMS Development
1.2 The Intrinsic Characteristics of MEMS
1.2.1 Miniaturization
1.2.2 Microelectronics Integration
1.2.3 Mass Fabrication with Precision
1.3 Devices: Sensors and Actuators
1.3.1 Energy Domains and Transducers
1.3.2 Sensors
1.3.3 Actuators
Summary
Problems
References
Chapter 2 Introduction to Microfabrication
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2.1 Overview of Microfabrication
2.2 The Microelectronics Fabrication Process
2.3 Silicon-Based MEMS Processes
2.4 New Materials and Fabrication Processes
2.5 Points of Consideration for Processing
Summary
Problems
References
Chapter 3 Review of Essential Electrical and Mechanical Concepts
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3.1 Conductivity of Semiconductors
3.1.1 Semiconductor Materials
3.1.2 Calculation of Charge Carrier Concentration
3.1.3 Conductivity and Resistivity
3.2 Crystal Planes and Orientation
3.3 Stress and Strain
3.3.1 Internal Force Analysis: Newton's Laws of Motion
3.3.2 Definitions of Stress and Strain
3.3.3 General Scalar Relation Between Tensile Stress and Strain
3.3.4 Mechanical Properties of Silicon and Related Thin Films
3.3.5 General Stress-Strain Relations
3.4 Flexural Beam Bending Analysis Under Simple Loading Conditions
3.4.1 Types of Beams
3.4.2 Longitudinal Strain Under Pure Bending
3.4.3 Deflection of Beams
3.4.4 Finding the Spring Constants
3.5 Torsional Deflections
3.6 Intrinsic Stress
3.7 Resonant Frequency and Quality Factor
3.8 Active Tuning of the Spring Constant and Resonant Frequency
3.9 A List of Suggested Courses and Books
Summary
Problems
References
Chapter 4 Electrostatic Sensing and Actuation
4.0 Preview 103
4.1 Introduction to Electrostatic Sensors and Actuators
4.2 Parallel-Plate Capacitors
4.2.1 Capacitance of Parallel Plates
4.2.2 Equilibrium Position of Electrostatic Actuator Under Bias
4.2.3 Pull-In Effect of Parallel-Plate Actuators
4.3 Applications of Parallel-Plate Capacitors
4.3.1 Inertia Sensor
4.3.2 Pressure Sensor
4.3.3 Flow Sensor
4.3.4 Tactile Sensor
4.3.5 Parallel-Plate Actuators
4.4 Interdigitated Finger Capacitors
4.5 Applications of Comb-Drive Devices
4.5.1 Inertia Sensors
4.5.2 Actuators
Summary
Problems
References
Chapter 5 Thermal Sensing and Actuation
Chapter 6 Piezoresistive Sensors
Chapter 7 Piexoelectric Sensing and Actuation
Chapter 8 Magnetic Actuation
Chapter 9 Summary of Sensing and Actuation
Chapter 10 Bulk Micromachining and Silicon Anisotropic Etching
Chapter 11 Surface Micromachining
Chapter 12 Polymer MEMS
Chapter 13 Microfluidics Applications
Chapter 14 Instruments for Scanning Probe Microscopy
Chapter 15 Optical MEMS
Chapter 16 MEMS Technology Management
Appendix A Material Properties
Appendix B Frequently Used Formulas for Beams and Membranes
Index
