电子组装技术专业英语

电子组装技术专业英语
作 者: 宋长发
出版社: 国防工业出版社
丛编项:
版权说明: 本书为出版图书,暂不支持在线阅读,请支持正版图书
标 签: 电工电子
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作者简介

暂缺《电子组装技术专业英语》作者简介

内容简介

《微电子制造技术系列丛书:电子组装技术专业英语》按照生产企业电子组装工艺流程介绍了组装元器件、印制电路板、助焊剂、胶黏剂、焊料、清洗剂等材料的基本知识,介绍了电子组装生产线的组成、贴片机的基本结构和作用。简要介绍了焊接技术、清洗技术、检测技术等电子组装各工艺环节的工艺方法,生产过程中的静电防护技术等内容。本教材适合作为应用型、技能型人才培养的大专院校(高职高专)应用电子类专业教材,也可作为电子组装专业技术培训用书,供从事电子组装工程技术人员参考。

图书目录

unit one

 1.1 printed circuit assembly

 1.2 assembly techniques

 1.3 smt design and assembly

 1.4 pcb assembly flows

unit two smc and smd

 2.1 surface mount device definitions

 2.2 sizes of surface mount device

 2.3 smd chip resistors

 2.4 smd ceramic capacitors

 2.5 smd tantalum capacitors

 2.6 smd melf

 2.7 smd transistors

 2.8 mounting of surface mount component

 2.9 component size comparison

unit three printed circuit boards

 3.1 the types of printed circuit board

 3.2 pcb design

 3.3 pcbs raw materials

 3.4 drilling and plating the holes of printed circuit boards

 3.5 creating the printed circuit pattern on the substrate

 3.6 attaching the contact fingers

unit four adhesives

unit five types of solder paste fluxes

 5.1 flux and its requirement

 5.2 inorganic acid fluxes

 5.3 organic acid fluxes

 5.4 rosin

 5.5 no-clean fluxes

unit six solder alloys and applications

 6.1 introduction

 6.2 availability and type of solders

unit seven surface mounted technology

 7.1 component placement machines

 7.2 surface mounted technology

 7.3 component pick-up head types

unit eight techniques of solder interconnection

 8.1 soldering iron method

 8.2 hot air reflow soldering method

 8.3 laser reflow soldering method

 8.4 pulse heating method

 8.5 ir method

 8.6 vapor phase soldering (vps)method

 8.7 convection reflow method(air or n2 reflow)

 8.8 combined convection ir method

 8.9 flow/wave soldering method

 8.10 the temperature profile concept

 8.11 pb-free soldering process

unit nine cleaning

 9.1 water-soluble fluxes

 9.2 no-clean fluxes

 9.3 pcb assembly cleaning

 9.4 pcb cleaning test

unit ten sma inspection technique

 10. 1 vision system of component placement machines

 10.2 inspection process

 10.3 visual inspection equipment

 10.4 visual inspection items

unit eleven handling and esd control

 11.1 electrostatic discharge

 11.2 esd and eos

 11.3 requirements of static-free work station

附录a cp-6系列富士贴片机操作简介

 a1.1 machine components and operation panel

 a1.2 starting and stopping the machine

附录b 专业词汇

 refeences